XC2VP40-6FFG1152C

Product Summary

The XC2VP40-6FFG1152C is a platform FPGA for designs that are based on IP cores and customized modules. The XC2VP40-6FFG1152C incorporates multi-gigabit transceivers and PowerPC CPU blocks in Virtex-II Pro Series FPGA architecture. It empowers complete solutions for telecommunication, wireless, networking, video, and DSP applications. The leading-edge 0.13 μm CMOS nine-layer copper process and Virtex-II Pro architecture are optimized for high performance designs in a wide range of densities. Combining a wide variety of flexible features and IP cores, the XC2VP40-6FFG1152C enhances programmable logic design capabilities and is a powerful alternative to mask-programmed gate arrays.

Parametrics

XC2VP40-6FFG1152C absolute maximum ratings: (1)VCCINT, Internal supply voltage relative to GND: –0.5 to 1.6 V; (2)VCCAUX, Auxiliary supply voltage relative to GND: –0.5 to 3.0 V; (3)VCCO, Output drivers supply voltage relative to GND: –0.5 to 3.75 V; (4)VBATT, Key memory battery backup supply: –0.5 to 4.05 V; (5)VREF, Input reference voltage: –0.3 to 3.75 V; (6)VIN: 3.3V I/O input voltage relative to GND (user and dedicated I/Os): –0.3 to 4.05 V; 2.5V or below I/O input voltage relative to GND (user and dedicated I/Os): –0.5 to VCCO + 0.5 V; (7)VTS: Voltage applied to 3-state 3.3V output (user and dedicated I/Os:) –0.3 to 4.05 V; Voltage applied to 3-state 2.5V or below output (user and dedicated I/Os): –0.5 to VCCO + 0.5 V; (8)AVCCAUXRX, Receive auxilliary supply voltage relative to GNDA (analog ground): –0.5 to 3.0 V; (9)AVCCAUXTX, Transmit auxilliary supply voltage relative to GNDA (analog ground): –0.5 to 3.0 V; (10)VTRX, Terminal receive supply voltage relative to GND: –0.5 to 3.0 V; (11)VTTX, Terminal transmit supply voltage relative to GND: –0.5 to 3.0 V; (12)TSTG, Storage temperature (ambient): –65 to +150 ℃; (13)TSOL, Maximum soldering temperature: All regular FG/FF flip-chip packages: +220 ℃; Pb-free FGG256 wire-bond package: +260 ℃; Pb-free FGG456 and FGG676 wire-bond packages: +250 ℃; (14)TJ, Maximum junction temperature: +125 ℃.

Features

XC2VP40-6FFG1152C features: (1)High-Performance Platform FPGA Solution, Including: Up to twenty RocketIO or RocketIO X embedded Multi-Gigabit Transceivers (MGTs); Up to two IBM PowerPC RISC processor blocks; (2)Flexible logic resources; (3)SRAM-based in-system configuration; (4)Active Interconnect technology; (5)SelectRAM?+ memory hierarchy; (6)Dedicated 18-bit x 18-bit multiplier blocks; (7)High-performance clock management circuitry; (8)SelectI/O-Ultra technology; (9)XCITE Digitally Controlled Impedance (DCI) I/O.

Diagrams